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INTEGRATED CIRCUITS
DATA SHEET
TDA8540 4 x 4 video switch matrix
Product specification Supersedes data of April 1993 File under Integrated Circuits, IC02 1995 Feb 06
Philips Semiconductors
Philips Semiconductors
Product specification
4 x 4 video switch matrix
FEATURES * I2C-bus or non-I2C-bus mode (controlled by DC voltages) * S-VHS or CVBS processing * 3-state switches for all channels * Selectable gain for the video channels * sub-address facility * Slave receiver in the I2C mode * Auxiliary logic outputs for audio switching * System expansion possible up to 7 devices (28 sources) * Static short-circuit proof outputs * ESD protection. APPLICATIONS * Colour Television (CTV) receivers * Peritelevision sets * Satellite receivers. QUICK REFERENCE DATA SYMBOL VCC ICC ISO B ct PARAMETER supply voltage supply current isolation `OFF' state 3 dB bandwidth crosstalk attenuation between channels at f = 5 MHz CONDITIONS - 60 12 60 MIN. 7.2 - 20 80 - 70 TYP. GENERAL DESCRIPTION
TDA8540
The TDA8540 has been designed for switching between composite video signals, therefore the minimum of four input lines are provided as requested for switching between two S-VHS sources. Each of the four outputs can be set to a high impedance state, to enable parallel connection of several devices.
MAX. 8.8 30 - - - V
UNIT mA dB MHz dB
ORDERING INFORMATION TYPE NUMBER TDA8540 TDA8540T PACKAGE NAME DIP20 SO20 DESCRIPTION plastic dual in-line package; 20 leads (300 mil) plastic small outline package; 20 leads; body width 7.5 mm VERSION SOT146-1 SOT163-1
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Philips Semiconductors
Product specification
4 x 4 video switch matrix
BLOCK DIAGRAM
TDA8540
handbook, full pagewidth
VCC(D0,1) SWITCH MATRIX 15
VCC(D2,3) 4
IN3
12
PEAKCLAMP
GAIN
DRIVER 3
3 OUT3
IN2
10
PEAKCLAMP
GAIN
DRIVER 2
1 OUT2
IN1
8
PEAKCLAMP/ BIAS
GAIN
DRIVER 1
14 OUT1
IN0
6
PEAKCLAMP/ BIAS 2 CL0 to CL1 4 DECODER 1 OF 4 2 SUPPLY 4 4 4 DECODER 1 OF 4 2
GAIN
DRIVER 0
16
OUT0
DECODER DECODER 1 OF 4 1 OF 4 2 2
G0 to G3 4
EN0 to EN3 4 17 D1 2 D0
VCC DGND AGND
13 20 9
TDA8540
I 2 C RECEIVER 11 7 5 18 19
power reset
MLA279 - 2
S0
S1
S2
SCL
SDA
Fig.1 Block diagram.
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Philips Semiconductors
Product specification
4 x 4 video switch matrix
PINNING SYMBOL OUT2 D0 OUT3 VCC(D2,3) S2 IN0 S1 IN1 AGND IN2 S0 IN3 VCC OUT1 VCC(D0,1) OUT0 D1 SCL SDA DGND PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 DESCRIPTION video output 2 control output 0 video output 3 driver supply voltage; for drivers 2 and 3 sub-address input 2 video input 0 (CVBS or chrominance signal) sub-address input 1 video input 1 (CVBS or chrominance signal) analog ground video input 2 (CVBS or luminance signal) sub-address input 0 video input 3 (CVBS or luminance signal) general supply voltage video output 1 driver supply voltage; for drivers 0 and 1 video output 0 control output 1 serial clock input serial data input/output digital ground
handbook, halfpage
TDA8540
OUT2 D0 OUT3 VCC(D2,3) S2 IN0 S1 IN1 AGND
1 2 3 4 5 TDA8540 6 7 8 9
20 DGND 19 SDA 18 SCL 17 D1 16 OUT0 15 VCC(D0,1) 14 OUT1 13 VCC 12 IN3 11 S0
MLA277 - 2
IN2 10
Fig.2 Pinning configuration.
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Philips Semiconductors
Product specification
4 x 4 video switch matrix
FUNCTIONAL DESCRIPTION The TDA8540 is controlled via a bidirectional I2C-bus. 3 bits of the I2C address can be selected via the address pin, thus providing a facility for parallel connection of 7 devices. Control options via the I2C-bus: * The input signals can be clamped at their negative peak (top sync). * The gain factor of the outputs can be selected between 1x or 2x. * Each of the four outputs can individually be connected to one of the four inputs. * Each output can individually be set in a high impedance state. * Two binary output data lines can be controlled for switching accompanying sound signals. The SDA and SCL pins (pins 19 and 18) can be connected to the I2C-bus or to DC switching voltage sources. Address inputs S0 to S2 (pins 11, 7 and 5) are used to select sub-addresses or switching to the non-I2C mode. Inputs S0 to S2 can be connected to the supply voltage (HIGH) or the ground (LOW). In this way no peripheral components are required for selection. Table 2 The TDA8540 protocol SEQUENCE S(1) Notes 1. S = START condition. 2. Data transmission to the TDA8540 starts with the slave address (SLV). 3. A = acknowledge bit, generated by TDA8540. 4. P = STOP condition. Table 3 A6 MSB 1 Notes 1. A2 to A0: pin programmable slave address bits. 2. R/W = 0; write only. After the SLV, a second byte, SUB, is required for selecting the functions, as shown in Table 4. Data transmission to the TDA8540 begins with SLV A5 0 A4 0 A3 1 A2 A2(1) A1 A1(1) A0 A0(1) SLV(2) A(3) SUB A(3) DATA A(3) DATA Table 1 S2 L L L L H H H H I2C-bus sub-addressing
TDA8540
SUB-ADDRESS S1 L L H H L L H H S0 A2 L H L H L H L H 0 0 0 0 1 1 1 non I2C A1 0 0 1 1 0 0 1 A0 0 1 0 1 0 1 0
addressable
I2C-bus control After power-up the outputs are initialized in the high impedance state, and D0 and D1 are at a LOW level. Detailed description of the I2C-bus specification, with applications, is given in brochure "The I2C-bus and how to use it". This brochure may be ordered using the code 9398 393 40011. The TDA8540 is a slave receiver and the protocol is given in Table 2.
A(3)
P(4)
R/W LSB 0(2)
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Philips Semiconductors
Product specification
4 x 4 video switch matrix
Table 4 7 MSB 0 Options for SUB: If SUB = 00H: access to switch control (SW1) If SUB = 01H: access to gain/clamp/data control (GCO) If SUB = 02H: access to output enable control (OEN). Remarks: If more than one data byte is sent, the SUB byte will be automatically incremented. The second byte: SUB 6 0 5 0 4 0 3 0 2 0 1 RS1
TDA8540
0 LSB RS0
If more than 3 data bytes are sent, the internal counter will roll over and the device will then rewrite the first register. Data Bytes SWI (SUB = 00H): selects which input is connected to the different outputs, as shown in Table 5. Table 5 7 MSB S31 Table 6 SWI (SUB = 00H) selection of inputs connected to outputs 6 S30 Selection of inputs Sj1 AND Sj0(1) OUTPUT 00 OUTj Note 1. For j = 0 to 3. Example: if S21 = 0 and S20 = 1, then OUT2 is connected to IN1. GCO (SUB = 01H): * Selects the gain of each output. * Selects the clamp action or mean value on inputs 0 and 1. * Determines the value of the auxiliary outputs D1 and D0. Table 7 7 MSB G3(1) Notes 1. For j = 0 to 3: if Gj = 0 (1), then output j has a gain of 2 (1). 2. If CL0 (CL1) = 0, then input signal on IN0 (IN1) is clamped. 3. For j = 0 or 1: if Dj = 0 (1), then logical output j is LOW (HIGH). GCO byte 6 G2(1) 5 G1(1) 4 G0(1) 3 CL1(2) 2 CL0(2) 1 D1(3) 0 LSB D0(3) IN0 01 IN1 10 IN2 11 IN3 5 S21 4 S20 3 S11 2 S10 1 S01 0 LSB S00
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Philips Semiconductors
Product specification
4 x 4 video switch matrix
OEN (SUB = 02H): selects, for each output, if the output is active or high impedance, see Table 8. Table 8 7 MSB X(1) Notes 1. X = don't care. 2. For j = 0 to 3: if ENj = 0 (1), then OUT j is high impedance (active). After a power-on reset: OEN (SUB = 02H) determines which output is active or high impedance 6 X(1) 5 X(1) 4 X(1) 3 EN3(2) 2 EN2(2) 1 EN1(2)
TDA8540
0 LSB EN0(2)
* The outputs are set to a high impedance state; the outputs are connected to IN0; the gains are set at two and inputs IN0 and IN1 are clamped. * Programming of the device is necessary because the outputs are in high impedance state. Non-I2C-bus control If the S0, S1 and S2 pins are all connected to VCC the device will enter the non-I2C-bus mode. After a power-on reset: * Gain is set at two for all outputs. * All inputs are clamped. * All outputs are active. * The matrix position is given by the SDA and SCL voltage level. Table 9 Non-I2C-bus control SCL AND SDA OUTPUT 00 OUT3 OUT2 OUT1 OUT0 SCL and SDA act as normal input pins: SCL interchanges (OUT3 and OUT2) with (OUT1 and OUT0). SDA interchanges OUT3 with OUT2 and OUT1 with OUT0. Remark: For use with chrominance signals, the clamp action must be overruled by external bias. IN3 IN2 IN1 IN0 01 IN2 IN3 IN0 IN1 10 IN1 IN0 IN3 IN2 11 IN0 IN1 IN2 IN3
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Philips Semiconductors
Product specification
4 x 4 video switch matrix
LIMITING VALUES In accordance with the Absolute Maximum System (IEC 134). SYMBOL VCC Ptot VCC(D0,1), VCC(D2,3) IN0 to IN3 OUT0 to OUT3 D0, D1 SDA, SDL S0 to S2 Tstg Tj Ves PARAMETER supply voltage (pin 13) total power dissipation driver supply voltage video input voltage video output voltage control output voltage I2C input/output voltage sub-address input voltage IC storage temperature junction temperature electrostatic handling HBM; note 1 MM; note 2 Notes 1. Human Body Model (HBM): in accordance with UZW-BO/FQ-A302. CONDITIONS - -0.3 -0.3 -0.3 -0.3 -0.3 -0.3 -55 - -1500 -200 MIN. -0.3
TDA8540
MAX. +9.1 750 +13.8 +7.2 +7.2 +7.2 +8.8 +8.8 +125 +150 +1500 +200 V
UNIT mW V V V V V V C C V V
2. Machine Model (MM): in accordance with UZW-BO/FQ-B302 (stress reference pins: AGND and DGND short-circuited and VCC). THERMAL CHARACTERISTICS SYMBOL Rth j-a SOT146-1 SOT163-1 OPERATING CHARACTERISTICS SYMBOL General VCC Tamb CI VI(p-p) VI(p-p) supply voltage (pin 13) operating ambient temperature 7.2 0 - note 1 note 2 - - - - 8.8 70 - 1 1.5 V C PARAMETER CONDITIONS MIN. TYP. MAX. UNIT PARAMETER thermal resistance from junction to ambient in free air 60 (typ.) 85 (typ.) K/W K/W VALUE UNIT
Video inputs (pins 6, 8, 10 and 12) external capacitor C signal amplitude (peak-to-peak value) CVBS or Y-signal amplitude (peak-to-peak value) 100 - - nF V V
Video drivers (pins 4 and 15) RD CD external collector resistor external decoupling capacitor note 3 note 4 - - 25 22 - - F
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Philips Semiconductors
Product specification
4 x 4 video switch matrix
SYMBOL PARAMETER CONDITIONS MIN.
TDA8540
TYP. - -
MAX. UNIT
Sub-address S0, S1 and S2 (pins 5, 7 and 11) VIH VIL Notes 1. Only for pins 6 and 8 when clamp action is not selected for these pins. 2. On all the video input pins, when non-I2C-bus control mode is selected or when clamp action is selected on pins 6 and 8 (by I2C-bus control). 3. Connected between VCC and pin 4 or pin 15. 4. Connected between AGND and pin 4 or pin 15. CHARACTERISTICS VCC = 8 V; Tamb = 25 C; gain condition, clamp condition and OFF state are controlled by the I2C-bus; unless otherwise specified. SYMBOL Supply ICC supply current without load OFF state Video inputs: IN0 to IN3 when the clamp is active (see Figs 3 and 4) ILI Vclamp Iclamp Vbias RI ZO RO ISO VO Vbias Gv Gdiff diff NL ct SVRR input leakage current input clamping voltage input clamping current VI = 3 V II = 5 A VI = 0 V II = 0 - - 1.2 - - 0.4 2.2 - 1 - - - - - - - 1 2.2 1.6 +1 7 3 - 2 - - A V mA - - 20 12 30 - mA mA PARAMETER CONDITIONS MIN. TYP. MAX. UNIT HIGH level input voltage LOW level input voltage 4 0 VCC 1 V V
Video inputs: IN0 and IN2 when the clamp is not active (see Fig.3) DC input bias level input resistance 2.9 10 - 5 - 0.7 1.9 1.3 0 6 0.5 0.6 0.5 70 55 V k
Video outputs: OUT0 to OUT3 (see Fig.5) output impedance output resistance isolation output top sync level; (Y or CVBS) output mean value for chrominance signals voltage gain differential gain differential phase non linearity crosstalk attenuation between channels supply voltage rejection G = 2; load = 150 G = 1; without load G = 1; f = 1 MHz G = 2; f = 1 MHz note 1 note 1 note 2 note 3 note 4 OFF state; f = 5 MHz OFF state 100 - 60 0.4 1.5 1 -1 5 - - - 60 36 k dB V V V dB dB % deg % dB dB
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Philips Semiconductors
Product specification
4 x 4 video switch matrix
SYMBOL G PARAMETER maximum gain variation CONDITIONS 100 kHz < f < 5 MHz 100 kHz < f < 12 MHz ct IOH VOL crosstalk attenuation of I2C-bus signals Auxiliary outputs D0 and D1 (open collector) HIGH level output current LOW level output voltage VOH = 5.5 V IOL = 4 mA - - - -10 - - - - - - - - - - - - MIN. - - 60 TYP. 0.5 1 3 -
TDA8540
MAX. UNIT - - - - dB dB dB dB A V A A pF
100 kHz < f < 8.5 MHz -
10 0.4
I2C-bus inputs SCL and SDA IIH IIL Ci HIGH level input current LOW level input current input capacitance VIH = 3.0 V VIL = 1.5 V 10 - 10
I2C-bus output SDA VOL IIH IIL Notes 1. Gain set at 2; RL = 150 ; test signal D2 from CCIR 330. 2. Gain set at 2; RL = 150 ; test signal D1 from CCIR 17. 3. Measured from any selected input to output; f = 5 MHz; RL = 150 ; gain set at 2; VI = 1.5 V (peak-to-peak value). This measurement requires an optimized board. V ripple (supply) 4. Supply voltage ripple rejection: 20 log ------------------------------------- ; V ripple (on output) measured at f = 1 kHz with V ripple (supply max) = 100 mV (peak-to-peak value). The supply voltage rejection ratio is >36 dB at fmax = 100 kHz. LOW level output voltage IOL = 3 mA VIH = VCC VIL = 0 V 0.4 V A A
Sub-address S0, S1 and S2 HIGH level input current LOW level input current 10 10
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Philips Semiconductors
Product specification
4 x 4 video switch matrix
TDA8540
book, full pagewidth
V ref = 2.2 V + V be 6V CLAMP CONTROL
IN0 or IN1
TDA8540
MLA282 - 1
Fig.3 IN0 and IN1 inputs.
handbook, halfpage VCC
VCC(D0,1) ( VCC(D2,3) )
handbook, halfpage
6V V ref = 2.2 V + Vbe
TDA8540
IN2 or IN3 OUT0 (OUT2)
TDA8540
MLA280
OUT1 (OUT3)
MLA281 - 1
Fig.4 IN2 and IN3 inputs.
Fig.5 Driver output stage.
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Philips Semiconductors
Product specification
4 x 4 video switch matrix
APPLICATION INFORMATION
TDA8540
handbook, full pagewidth
VCC 100 F
25 R D 22 F CD VCC(D2,3)
25 R 22 F CD VCC(D0,1) 15 3 1 D
VCC
Ci 100 nF
IN3
4 12
OUT3 OUT2 OUT1 OUT0 digital supply (+5 V) outputs
Ci 100 nF IN2 video sources Ci 100 nF 10
14 IN1 16
8
TDA8540
Ci 100 nF
IN0
6 17 D1 D0
10 k
10 k
VCC
13 20 DGND 9 AGND S0 S1 address inputs S2 SCL SDA 11 7 5 18 19
2
audio source control
MLA278 - 3
serial data and clock signals
VCC = analog supply (+8 V).
Fig.6 Application diagram.
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Philips Semiconductors
Product specification
4 x 4 video switch matrix
PACKAGE OUTLINES
TDA8540
seating plane
26.92 26.54 3.2 max 4.2 max
8.25 7.80
3.60 3.05 2.0 max 0.53 max 1.73 max
0.51 min 2.54 (9x) 0.254 M 0.38 max 7.62 10.0 8.3
MSA258
20
11 6.40 6.22
1
10
Dimensions in mm.
Fig.7 Plastic dual in-line package; 20 leads (300 mil); DIP20; SOT146-1.
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Philips Semiconductors
Product specification
4 x 4 video switch matrix
TDA8540
handbook, full pagewidth
13.0 12.6
7.6 7.4
A
S 0.9 (4x) 0.4
0.1 S
10.65 10.00
20
11 2.45 2.25 1.1 1.0 0.3 0.1 0.32 0.23 1.1 0.5 detail A 2.65 2.35
pin 1 index 1 10 0 to 8
o
MBC234 - 1
1.27
0.49 0.36
0.25 M (20x)
Dimensions in mm.
Fig.8 Plastic small outline package; 20 leads; body width 7.5 mm (SO20; SOT163-1).
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Philips Semiconductors
Product specification
4 x 4 video switch matrix
SOLDERING Plastic small outline packages BY WAVE During placement and before soldering, the component must be fixed with a droplet of adhesive. After curing the adhesive, the component can be soldered. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder bath is 10 s, if allowed to cool to less than 150 C within 6 s. Typical dwell time is 4 s at 250 C. A modified wave soldering technique is recommended using two solder waves (dual-wave), in which a turbulent wave with high upward pressure is followed by a smooth laminar wave. Using a mildly-activated flux eliminates the need for removal of corrosive residues in most applications. BY SOLDER PASTE REFLOW Reflow soldering requires the solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the substrate by screen printing, stencilling or pressure-syringe dispensing before device placement. Several techniques exist for reflowing; for example, thermal conduction by heated belt, infrared, and vapour-phase reflow. Dwell times vary between 50 and 300 s according to method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 min at 45 C.
TDA8540
REPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING
IRON OR PULSE-HEATED SOLDER TOOL)
Fix the component by first soldering two, diagonally opposite, end pins. Apply the heating tool to the flat part of the pin only. Contact time must be limited to 10 s at up to 300 C. When using proper tools, all other pins can be soldered in one operation within 2 to 5 s at between 270 and 320 C. (Pulse-heated soldering is not recommended for SO packages.) For pulse-heated solder tool (resistance) soldering of VSO packages, solder is applied to the substrate by dipping or by an extra thick tin/lead plating before package placement. Plastic dual in-line packages BY DIP OR WAVE The maximum permissible temperature of the solder is 260 C; this temperature must not be in contact with the joint for more than 5 s. The total contact time of successive solder waves must not exceed 5 s. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified storage maximum. If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron below the seating plane (or not more than 2 mm above it). If its temperature is below 300 C, it must not be in contact for more than 10 s; if between 300 and 400 C, for not more than 5 s.
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Philips Semiconductors
Product specification
4 x 4 video switch matrix
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA8540
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale. PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips' I2C patent to use the components in the I2C system provided the system conforms to the I2C specification defined by Philips. This specification can be ordered using the code 9398 393 40011.
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Philips Semiconductors
Product specification
4 x 4 video switch matrix
NOTES
TDA8540
1995 Feb 06
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Philips Semiconductors
Product specification
4 x 4 video switch matrix
NOTES
TDA8540
1995 Feb 06
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Philips Semiconductors
Product specification
4 x 4 video switch matrix
NOTES
TDA8540
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Philips Semiconductors - a worldwide company
Argentina: IEROD, Av. Juramento 1992 - 14.b, (1428) BUENOS AIRES, Tel. (541)786 7633, Fax. (541)786 9367 Australia: 34 Waterloo Road, NORTH RYDE, NSW 2113, Tel. (02)805 4455, Fax. (02)805 4466 Austria: Triester Str. 64, A-1101 WIEN, P.O. Box 213, Tel. (01)60 101-1236, Fax. (01)60 101-1211 Belgium: Postbus 90050, 5600 PB EINDHOVEN, The Netherlands, Tel. (31)40 783 749, Fax. (31)40 788 399 Brazil: Rua do Rocio 220 - 5th floor, Suite 51, CEP: 04552-903-SAO PAULO-SP, Brazil. P.O. Box 7383 (01064-970). Tel. (011)821-2333, Fax. (011)829-1849 Canada: PHILIPS SEMICONDUCTORS/COMPONENTS: Tel. (800) 234-7381, Fax. (708) 296-8556 Chile: Av. Santa Maria 0760, SANTIAGO, Tel. (02)773 816, Fax. (02)777 6730 Colombia: IPRELENSO LTDA, Carrera 21 No. 56-17, 77621 BOGOTA, Tel. (571)249 7624/(571)217 4609, Fax. (571)217 4549 Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S, Tel. (032)88 2636, Fax. (031)57 1949 Finland: Sinikalliontie 3, FIN-02630 ESPOO, Tel. (9)0-50261, Fax. (9)0-520971 France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex, Tel. (01)4099 6161, Fax. (01)4099 6427 Germany: P.O. Box 10 63 23, 20043 HAMBURG, Tel. (040)3296-0, Fax. (040)3296 213. Greece: No. 15, 25th March Street, GR 17778 TAVROS, Tel. (01)4894 339/4894 911, Fax. (01)4814 240 Hong Kong: PHILIPS HONG KONG Ltd., 15/F Philips Ind. Bldg., 24-28 Kung Yip St., KWAI CHUNG, N.T., Tel. (852)424 5121, Fax. (852)480 6960/480 6009 India: Philips INDIA Ltd, Shivsagar Estate, A Block , Dr. Annie Besant Rd. Worli, Bombay 400 018 Tel. (022)4938 541, Fax. (022)4938 722 Indonesia: Philips House, Jalan H.R. Rasuna Said Kav. 3-4, P.O. Box 4252, JAKARTA 12950, Tel. (021)5201 122, Fax. (021)5205 189 Ireland: Newstead, Clonskeagh, DUBLIN 14, Tel. (01)640 000, Fax. (01)640 200 Italy: PHILIPS SEMICONDUCTORS S.r.l., Piazza IV Novembre 3, 20124 MILANO, Tel. (0039)2 6752 2531, Fax. (0039)2 6752 2557 Japan: Philips Bldg 13-37, Kohnan 2 -chome, Minato-ku, TOKYO 108, Tel. (03)3740 5028, Fax. (03)3740 0580 Korea: (Republic of) Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL, Tel. (02)794-5011, Fax. (02)798-8022 Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR, Tel. (03)750 5214, Fax. (03)757 4880 Mexico: 5900 Gateway East, Suite 200, EL PASO, TX 79905, Tel. 9-5(800)234-7381, Fax. (708)296-8556 Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB Tel. (040)783749, Fax. (040)788399 New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND, Tel. (09)849-4160, Fax. (09)849-7811 Norway: Box 1, Manglerud 0612, OSLO, Tel. (022)74 8000, Fax. (022)74 8341 Pakistan: Philips Electrical Industries of Pakistan Ltd., Exchange Bldg. ST-2/A, Block 9, KDA Scheme 5, Clifton, KARACHI 75600, Tel. (021)587 4641-49, Fax. (021)577035/5874546. Philippines: PHILIPS SEMICONDUCTORS PHILIPPINES Inc, 106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI, Metro MANILA, Tel. (02)810 0161, Fax. (02)817 3474 Portugal: PHILIPS PORTUGUESA, S.A., Rua dr. Antonio Loureiro Borges 5, Arquiparque - Miraflores, Apartado 300, 2795 LINDA-A-VELHA, Tel. (01)4163160/4163333, Fax. (01)4163174/4163366. Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231, Tel. (65)350 2000, Fax. (65)251 6500 South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale, 2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000, Tel. (011)470-5911, Fax. (011)470-5494. Spain: Balmes 22, 08007 BARCELONA, Tel. (03)301 6312, Fax. (03)301 42 43 Sweden: Kottbygatan 7, Akalla. S-164 85 STOCKHOLM, Tel. (0)8-632 2000, Fax. (0)8-632 2745 Switzerland: Allmendstrasse 140, CH-8027 ZURICH, Tel. (01)488 2211, Fax. (01)481 77 30 Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66, Chung Hsiao West Road, Sec. 1. Taipeh, Taiwan ROC, P.O. Box 22978, TAIPEI 100, Tel. (02)388 7666, Fax. (02)382 4382. Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd., 209/2 Sanpavuth-Bangna Road Prakanong, Bangkok 10260, THAILAND, Tel. (662)398-0141, Fax. (662)398-3319. Turkey: Talatpasa Cad. No. 5, 80640 GULTEPE/ISTANBUL, Tel. (0 212)279 2770, Fax. (0212)282 6707 United Kingdom: Philips Semiconductors LTD., 276 Bath Road, Hayes, MIDDLESEX UB3 5BX, Tel. (0181)730-5000, Fax. (0181)754-8421 United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409, Tel. (800)234-7381, Fax. (708)296-8556 Uruguay: Coronel Mora 433, MONTEVIDEO, Tel. (02)70-4044, Fax. (02)92 0601
Internet: http://www.semiconductors.philips.com/ps/ For all other countries apply to: Philips Semiconductors, International Marketing and Sales, Building BE-p, P.O. Box 218, 5600 MD, EINDHOVEN, The Netherlands, Telex 35000 phtcnl, Fax. +31-40-724825 SCD38 (c) Philips Electronics N.V. 1994
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
533061/1500/03/pp20 Document order number: Date of release: 1995 Feb 06 9397 747 30011
Philips Semiconductors

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